FAILURE ANALYSIS ENGINEER SKILLS, EXPERIENCE, AND JOB REQUIREMENTS

Updated: Jun 13, 2025 - The Failure Analysis Engineer specializes in advanced characterization instrumentation including SEM, TEM, FIB, XPS, and SIMS, particularly for semiconductor and optoelectronic wafers. Experienced in statistical analysis and Six Sigma methodologies, with a strong emphasis on Quality Control and Process Improvements. This position demonstrates leadership in managing teams and projects, with a profound ability to analyze device/material failures and provide technical solutions.

Essential Hard and Soft Skills for a Standout Failure Analysis Engineer Resume
  • Failure Analysis
  • Root Cause Analysis
  • Process Improvement
  • Technical Writing
  • Data Analysis
  • Equipment Qualification
  • Advanced Imaging
  • Report Quality Control
  • Test Development
  • Technical Documentation
  • Collaboration
  • Problem Solving
  • Project Coordination
  • Leadership
  • Creative Thinking
  • Communication
  • Cross-functional Coordination
  • Team Leadership
  • Vendor Coordination
  • Strategic Planning

Summary of Failure Analysis Engineer Knowledge and Qualifications on Resume

1. BS in Materials Science and Engineering with 4 years of Experience

  • Experience in failure analysis of discrete, Power products, Mosfet and Logic, analog, and/or mixed signal IC devices.
  • Hands-on experience in failure analysis, and electrical fault isolation and defect characterization tools and techniques such as the following ATE, curve trace, micro-probing, light emission microscopy, PEM/OBIRCH, liquid crystal, CSAM, XRAY, FIB, SEM and de-processing techniques.
  • In-depth understanding of both digital and analog circuits, device physics and IC fabrication processes. 
  • Familiar with the FA process flow and analysis techniques.
  • Ability to interpret system level schematics, the IC level schematics, and IC layout of CMOS and bipolar devices
  • Strong understanding in discrete, Mosfets and IC and knowledge of Fab process is an added advantage.
  • Able to work in dynamic environment supporting various types of analysis for assembly, test, and wafer fab operations.
  • Strong demonstrable experience with electrical test equipment including Power Supplies, Multimeter, Oscilloscopes, and other common equipment.
  • Experience with hand tools, basic power tools, soldering, and instrumentation.
  • Extremely proficient at reading schematics and troubleshooting analog and digital circuits.
  • Familiarity with basic failure analysis techniques including 2D and 3D X-Ray, Cross Sectioning, SEM, and FLIR Thermography.
  • Ability to design for Reliability processes and principles including ALT, HALT, Weibull analysis, reliability prediction including FIT rates, MTTF, life data analysis, DFMEA, PFMEA.
  • Excellent written and verbal communication skills

2. BS in Mechanical Engineering with 3 years of Experience

  • Experience with internships or Capstone-like projects in electrical design, reliability, or failure analysis.
  • Experience with power supplies, inverters, connectors or solar power.
  • Experience in medical device engineering or failure analysis.
  • Proven ability to work in teams and to work cross-functionally.
  • Strong interpersonal and communication skills
  • Passionate about the mission to improve product quality.
  • Able to assist people in finding creative solutions around constraints.
  • Strong analytic skills as proven by track record for analyzing complex problems
  • Ability to verify assembly documentation accuracy and to read engineering drawings, etc.
  • Ability to examine a problem at a broad systems level to identify interrelationships and evaluate from multiple angles, and then to drill down into the details to understand the impacts of specific areas.
  • Knowledge of Good Manufacturing Practices & Quality Systems Regulations is a plus.
  • Proficient in the use of Microsoft Office suite of applications.
  • Familiarity with SAP and Tableau

3. BS in Electrical Engineering with 2 years of Experience

  • Ability to self-prioritize and manage multiple projects simultaneously, adapting to regular changes in priority
  • Structured failure analysis investigation
  • Direct communication with internal and external customers
  • Excellent written communication to develop comprehensive engineering reports
  • Ability to read product drawings and Statistical data analysis
  • Knowledge of DoE and Strong EE fundamentals
  • Knowledge of reliability testing
  • Hands-on use of any of the following equipment, including Electrical multimeters, Data loggers, CT X-ray and Scanning Electric Microscope
  • Analog, high speed digital etc. design/testing/FA experience
  • Deep understanding of schematic and PCB layout design
  • Understanding the concept of failure analysis
  • Experienced in MS Office
  • Good mechanical skills (assembly and disassembly of parts and systems)

4. BS in Chemical Engineering with 4 years of Experience

  • Proficiency in various physical and electrical analysis techniques such as mechanical polishing, Chemical delayering, SEM inspection, curve trace, thermal emission, photon emission, OBIRCH/TIVA.
  • Experience in nano-probing for advanced tech node device.
  • Strong knowledge of semiconductor physics, semiconductor devices, circuitry analysis and wafer fabrication process.
  • Good organization and project management skills, be able to work in a laboratory environment, and be effective getting results by working with multi-functional teams.
  • Good hands-on of DMM, oscilloscope, probe station, TDR, LIT etc. EE tools
  • Familiar with SEM/FIB etc. PFA tools
  • Ability to clearly explain technical decisions with data
  • Deep knowledge of manufacturing raw materials
  • Experience with formal documentation
  • Ability to interpret mechanical drawings and electrical schematics
  • Ability to lead multiple tasks while being very well organized (know how to work in Multitasking mode and to priorities the tasks)
  • Strong communication skills, both written and verbal and strong Interpersonal relationship

5. BS in Physics with 3 years of Experience

  • Experience in troubleshooting discrete and passive components including resistors, capacitors, diodes, inductors, transformers, transducers, relays, etc.
  • Knowledge of PWBs, ICs, IGBTs, generators, batteries, and related electric devices will be invaluable.
  • Hands-on experience with electrical test equipment such as multi-meters, curve tracer, power supplies, oscilloscopes, etc.
  • Understanding of component fabrication and assembly processes and testing.
  • Familiarity with component and system level electrical and mechanical failure modes and materials.
  • Excellent communication skills and authorship of detailed technical reports.
  • Ability to balance multiple tasks and priorities, and thrive in a fast-paced, schedule-driven environment.
  • Aptitude to effectively lead a small team in gathering evidence and test data to resolve problems.
  • Ability to establish and maintain effective relationships with stakeholders across the functions, from suppliers to BAE manufacturing, to achieve the optimal design and manufacture of the product.
  • Interpersonal skills when interfacing and coordinating with company personnel, customers, and suppliers.
  • Adept using word processing, presentation, and spreadsheet software applications to prepare reports and analyze data.
  • Exercise discretion and independent judgment in the performance of duties while complying with policies, procedures, appropriate principles and applicable state and federal laws.
  • Experience with Microscopy, Radiography, Mechanical/Chemical De-processing, Cross-Sectioning, Dye & Pry, and various materials analysis techniques, e.g. Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS)
  • Understanding of PWB manufacturing and assembly processes including reflow, wave soldering, select wave, etc.
  • Knowledge of adhesives, conformal coats, underfills, encapsulants, etc.

6. BA in Applied Mathematics with 2 years of Experience

  • Hands-on proficiency with electrical fault isolation tools and techniques such as photo-emission, static and dynamic laser stimulation, LVx, scan diagnostic techniques, ATE, thermal imaging, nanoprobing, and applications bench testing
  • In-depth understanding of CAD layout, ATE and bench test datalogs, digital and analog circuits, device physics, IC fabrication and assembly
  • Familiarity with common IC failure mechanisms and qual stress configurations
  • Excellent analytical skills and problem-solving ability
  • Strong technical writing and verbal communication skills
  • Experience in failure analysis of non-volatile memory (NVM) devices
  • Hands-on proficiency with physical failure analysis tools and techniques such as SEM, FIB, AFM, planar delayering, chemical deprocessing, chemical decoration
  • Ability to understand and resolve advanced failure analysis problems and escalates through the appropriate channels
  • Able to work collaboratively within a team, sharing technical expertise and knowledge.
  • Good written and verbal communication skills, ensuring a consistently high standard of detailed information capture.
  • Knowledge of process improvement methodologies and tools (8D capability), Statistical methodologies. 
  • Failure analysis and problem solving experience.
  • Experienced in MS Office applications.
  • Proficient in home country language.
  • Good in written English. spoken English

7. BS in Civil Engineering with 3 years of Experience

  • Familiarity with basic failure analysis techniques including 2D and 3D X-Ray, Cross Sectioning, SEM, and Thermography
  • User-level expertise with basic EE tools (Oscilloscopes, Power Analyzers, Network Analyzers, Signal Generators, etc.)
  • Data analysis and reporting experience
  • Experience in power electronics with knowledge of electronic assemblies and PCBAs
  • Excellent written and oral communication skills
  • Self-motivated with success working with interdisciplinary teams
  • Experience with contract manufacturing and supplier models for failure analysis
  • Experience working in a laboratory environment
  • Knowledge of physics of reliability failure mechanisms
  • Experience in hardware system failure analysis/debug.
  • Experience with R&D lab tests and equipment.
  • Ability to analyze products' hardware, mechanical and software changes.
  • Basic programming knowledge (C, Perl, Python) in Linux environment.

8. BS in Industrial Engineering with 4 years of Experience

  • Knowledge of servers and network technologies
  • Knowledge of test methodologies, writing test plans, creating test cases and debugging
  • Experience analyzing statistical reliability and warranty data
  • Strong interpersonal skills and the ability to interact with people at various levels in the organization
  • Proficiency with Microsoft Office applications
  • Ability to work in a fast-paced environment
  • Good analytical hands-on skills
  • Experience executing tests and automating test cases
  • Familiarity with high frequency power conversion theory including DC-DC, AC-DC, attenuation and filtering
  • Ability to understand written and verbal instructions, assembly prints and schematics
  • Good verbal and written communication skills
  • Good technical analytical skills

9. BS in Aerospace Engineering with 3 years of Experience

  • Knowledge of digital, analog and RF Integrated circuit analysis,
  • Semiconductor device physics basics
  • Knowledge and experience of semiconductor process and assembly
  • Hands-on lab experience using lab test equipment (oscilloscope, network analyzer, spectrum analyzer), IR thermal, and photo emission microscope
  • Proficient with MS Office, particularly with MS Excel software
  • Ability to successfully develop and present reports/presentations
  • Excellent verbal and written communication skills
  • Ability to successfully communicate with individuals at all levels of the business and demonstrate strong interpersonal skills
  • Utilizes a proactive and persistent approach and demonstrates a sense of urgency
  • Ability to handle multiple tasks simultaneously and efficiently
  • Ability to complete work in a timely manner and prioritize jobs in accordance with requirements
  • Knowledge of the common failure modes of electronic components and assemblies.
  • Ability to design, build, and assemble prototype circuits for test fixtures.
  • Document quality issues and performance measures for management review.

10. BA in Computer Science with 2 years of Experience

  • Experience in Hardware Engineering or Component Engineering, including Analog and digital circuit design, Embedded microprocessor & FPGA design
  • Understanding of signal integrity for high-speed design
  • Familiarity with lab equipment such as voltmeters and oscilloscopes.
  • Experience with the equipment used to replace electronic components
  • Experience with environmental chambers used to stress field returns.
  • Demonstrated strong communication skills with the ability to relay technical information in English (verbal, written and interpersonal) to exchange information on field failures.
  • Analytical ability to determine and develop solutions to moderately complex problems
  • Experience in product failure analysis and root cause identification
  • Flexibility to respond to urgent project requests and/or changing priorities
  • Experience in collaborating (either by telephone, e-mail or directly) with people in multiple countries and time zones, exchanging information
  • Experience in troubleshooting and failure analysis of electronic circuits, both analogue and digital.
  • Understanding of schematics and how the components of a circuit function.
  • Proficient in Word, PowerPoint, Excel, and Access.

11. BS in Metallurgical Engineering with 4 years of Experience

  • Experience with SIMS or TOF-SIMS
  • Expertise in a group of advanced characterization instrumentation such as SEM, TEM, FIB, XPS
  • Proficiency in statistics and experience in Sig-Sigma and Quality management tools are desirable.
  • Expertise in SIMS for semiconductor wafers, optoelectronic wafers, substrate wafers, and other materials.
  • Experience and background in a group of advanced characterization instrumentation such as SIMS, SEM-EDX-EBSD, TEM, Auger, XPS, ICP-MS, GDMS, AFM, XRD, Raman, TGA-DSC, FT-IR, UV-Vis, Optical Surface Characterization (surface roughness, flatness, etc.), NMR/Solid-State, ESR, BET-Pore Size Distribution, Particle Size Distributions (Laser Scattering), etc.
  • Experiences in thin film and III-V epitaxial growth technology (MOCVD, MBE, Sputtering, spin-coating, etc.), semiconductor fabrication, optoelectronics, crystal growth and fabrication, etc.
  • Experience in product Quality Control and Process Improvements, particularly in Six Sigma methodology (Six-Sigma Black Belt preferred).
  • Proficiency in statistics, Design of Experiments, Regressions, and utilization of statistic tools in data analysis for decision making for process controls and process improvements.
  • Ability to develop device/material failure models, issues analytical reports, and offers professional/technical advice.
  • Ability to direct and manage direct reports to deliver high-performance outputs for internal/external customers on a daily and sustainable basis.
  • Knowledge of Microsoft Word, Excel, PowerPoint & Outlook, and other software such as JMP, MATLAB and MiniTab.
  • Strong project management and written and verbal communication skills.
  • Ability to manage multiple customers and projects simultaneously.
  • Leadership capabilities to effectively work with and direct technicians
  • Strong interpersonal, teaming, and problem-solving skills.
Relevant Information
Failure Analysis Technician Skills, Experience, and Job Requirements