• Provide direction and techniques on the customer’s issues, duplication and isolation
• Engage Design engineering and communicate findings and resolutions for HW and SW field issues.
• Lead the FA cases review meeting with Engineering teams and other Cisco teams
• Evaluation of development of product life cycle test scenarios
• Defect detection including containment analysis
• Work closely with a cross-functional team of Product Leads, Technical Leads and Customer Support to accelerate replicate customer reported issue
• Articulate key technical issues to internal stakeholders, sense issues early, identify impact and partner to drive resolution.
• Project leadership for process improvements, initiatives to support stakeholders.
• Ensure EMS partner’s deliver timely and accurate results in duplicating, isolating root cause of customer issues.
• Working to reduce the test times for qualification flows thereby helping to meet the stringent customer deadlines while constantly improving the quality of the test flow.
• Driving and addressing any issues that shows up during the post-silicon coverage tests and providing a suitable solution to meet the tight customer specifications.
• Working with the hardware vendors in defining and developing boards for the ATE platforms and making sure that these boards are optimized for best performance with limited signal and power losses.

Skills: Customer Issue Resolution, Cross-functional Collaboration, Product Lifecycle Evaluation, Defect Detection, Project Leadership, Root Cause Analysis, Post-Silicon Testing, Hardware Optimization

• Perform failure analysis activities related to the design, manufacture, and reliability of subminiature microphones and receivers
• Supports new product introductions as well as sustaining mass production models
• Analyzing all factors of complex problems and presenting concise results to all levels of audiences
• Assignments are varied and require a results-driven approach, must be driven to investigate root cause of failures and work in team environment to determine corrective actions
• Assist with “change implementation” and the objective to transition the organization from a reactive to a proactive culture to better meet internal and external customer requirements
• Interact with functional groups at all levels (manufacturing, sales, marketing, etc.), to address and resolve critical product and customer issues
• Actively seek out and utilize technical expertise from within the company and from outside sources to assist in problem solving
• Develop new Failure Analysis procedures and tools then proliferate to the global Failure Analysis team for alignment
• Prepare technical reports
• Communicate suggestions to appropriate R&D, Test Development, Manufacturing, or management team in an effective and appropriate manner
• Work with and develop close relationships with internal customers to help solve technical problems
• Investigate additional or new technologies to provide better and more complete support to help solve customer issues

Skills: Failure Analysis, Root Cause Investigation, Cross-functional Collaboration, Technical Reporting, Problem Solving, Change Implementation, Process Improvement, Technology Evaluation

• Operate and maintain equipment such as a soldering station, optical measuring microscope, temp/RH chambers, high quality/fast print 3D printers, power supplies, electronic loads, PCB prototyping machine, and more.
• Support teams with assembly/disassembly of prototype devices and document instructions, board level modification (i.e. fine pitch soldering).
• Measure and collect power data of prototype devices and characterize and validate new prototype boards.
• Perform in-depth failure analysis on prototype devices and drive for root-cause data on bug tracking software.
• Establish reports on use of innovations for testing equipment, methodologies, or any continuous process improvement.
• Perform and document the failure mode analysis on returned or rejected lamps
• Lead the Root Cause Analysis (RCA) effort
• Compile, analyze and report results with the use of statistical tools
• Develop and evaluate new failure analysis test methods
• Advise on critical-to-quality characteristics
• Recommend improvements based on findings
• Discuss and resolve quality issues with suppliers
• Attend customer liaison meetings

Skills: Equipment Operation, Prototype Assembly, Failure Analysis, Root Cause Analysis, Data Collection, Process Improvement, Statistical Analysis, Supplier Collaboration

• Perform NAND memory characterization and failure analysis using automated test equipment (testers) and lab equipment such as oscilloscopes, logic analyzers, and temperature control systems.
• Create, maintain, and optimize characterization test flows using C programming and tester hardware.
• Automate data collection and processing by creating scripts in Python/Perl.
• Prepare formal characterization and memory failure analysis reports.
• Participate in meetings regarding test improvements and failure analysis.
• Designing, debugging and implementing electrical test strategies to bring out semiconductor defects in 3D NAND memory packages during mass manufacturing.
• Providing corrective actions for customer failures by suggesting ideas for production flow improvements while maintaining the DPPM level and meeting product requirements during various life cycles.
• Performing in-depth 3D NAND electrical Failure Analysis to narrow down the root-cause and making sure that similar failures can be caught on the upcoming generations of NAND
• Defining product specific NAND Flash Memory test flows including stress and screen tests to deliver very high quality memory components for embedded storage flash products.
• Interact with the design, device and other cross-functional teams to solve problems and overcome any major issues that might be gating the product shipments.
• Administering and determining system requirements and cost to determine project feasibility
• Reducing capacity as well as introducing innovative ways to reduce costs in order to remain competitive.

Skills: Memory Characterization, Failure Analysis, Test Automation, Scripting, Electrical Test Strategies, Corrective Actions, Cross-functional Collaboration, Cost Optimization

• Lead, drive and ensure completion of analysis and analysis report in a timely manner
• Ensure technical laboratory engineering activities meet company objectives and customer requirements
• Upkeep the laboratory activities and document procedures consistent with QMS requirements
• Technical partner with Business Unit Engineering and Operation teams on NPI, failure and defect analysis, incoming quality and customer return related matters.
• Drive the technical application and development of failure analysis engineering principles, theories and concepts
• Ensure FA equipment and tools are calibrated and maintained accordingly
• Ensure safety and 5S in all laboratory operation activities
• Provides technical guidance to Engineers and Technicians
• Provide consistent improvement in analytical techniques over time
• Successful failure analysis on a wide variety of ON Semiconductor products for internal and external customers. 
• Analyze and identify the cause of failures for a wide variety of product types including but not limited to Image Sensors, ASICs, Analog, Mixed Signal and Discretes.
• Electrical characterization and bench testing of failure mode using lab equipment like power supplies, parametric analyzers, oscilloscopes, DMMs, function generators, evaluation boards and other bench test equipment to develop a sound Failure Analysis plan.

Skills: Failure Analysis, Lab Management, Technical Leadership, Failure Mode Identification, Test Equipment Calibration, Process Improvement, Electrical Characterization, Cross-functional Collaboration

• Experience with critical failure analysis techniques such as 2D/3D Xray, Mechanical cross sectioning/Dye & Pry, SEM/EDX, FTIR, Microscopy, GC-MS, Ion Chromatography
• Experience in solving complex problems and making an impact in consumer electronic products
• Strong organizational and communication skills. 
• Ability to clearly communicate the FA findings and ensure that partners understand the issues and the changes required by writing FA reports for the key issues studied
• Ability to work in a fast-paced environment to meet product development milestones and maintain product launch schedules
• Experienced with typical electronic consumer manufacturing process such as PCBA/SMT/assembly
• Experience in engineering, quality, manufacturing, NPD or working in a technical role or high regulated environment.
• Experience in a regulated environment 
• Ability to interpret, analyze, and test electrical designs.
• Knowledge of electrical design process, electrical components, and systems.
• Ability to apply analysis tools and statistical methods.
• Knowledge of system components and associated requirements.

Qualifications: BA in Materials Science Engineering with 3 years of Experience

• Experience in quality and reliability engineering in the semiconductor industry.
• Experience in integrated circuits, components, electronic modules or systems (Knowledge of image sensor testing and quality).
• Excellent written and verbal communications skills with multinational experience.
• Demonstrated background in problem-solving of electronic components and systems
• Ability to work in multi-functional teams with minimum supervision.
• Strong interpersonal and communication skills, flexibility, team spirit, and positive approach.
• Experience with hardware product design and manufacturing.
• Ability to perform root cause analysis on power conversion products such as DC/DC converters using effective root cause tools (cause effect, 5W's, FEMA, Fault Tree)
• Advanced DC-DC design experience.
• Experience with Mil-Spec, FAA and/or Space qualified product
• Demonstrated experience leading direct and tough debates and resolving the issues.
• Excellent organizational, interpersonal, and communications skills.

Qualifications: BS in Mechanical Engineering with 4 years of Experience

• Experience with the root cause and 8D methodology
• Knowledge of various failure analysis techniques and tools used for semiconductor components, electrical components, optics, and sensors like X-ray, CSAM, thermal imaging, FIB, SEM etc.
• Demonstrates good judgment in selecting methods and techniques for obtaining a solution
• Strong interpersonal, planning, and organization skills
• Excellent oral and written communication skills
• Strong and creative problem-solving skills
• Experience with Matlab and Python
• Knowledge of HDD manufacturing and test processes, drive reliability, and associated failure mechanisms.
• Knowledge in data mining and understanding analytical tools/techniques such as SEM, AFM, Raman, ToF-SIMS, etc
• Good communication skills with proven problem-solving skills
• Experience with EVSEs, power electronics and grid power configurations
• Proven ability to apply scientific problem-solving techniques with strong attention to detail
• Excellent written, verbal and presentation skills
• Experience in troubleshooting scientific or analytical instruments

Qualifications: BA in Electrical Engineering with 3 years of Experience

• Ability to apply scientific problem-solving techniques with strong attention to detail
• Ability to manage a variety of cross-functional team members, a good team player
• In-depth experience with materials characterization and analytical techniques (e.g. optical microscopy, X-Ray, SEM/EDS, FTIR, XPS, etc.)
• Familiarity with engineering design software and documentation (3D modeling software, 2D schematics, circuit/block diagrams, component spec sheets, etc.)
• Hands-on experience with complex electro-mechanical systems in industrial and/or consumer devices.
• Knowledge of Industry Test Standards (JEDEC, ASTM, IEEE)
• Excellent communication skills (verbal and written) including emails, preparing slide presentations and presenting technical concepts to multi-disciplinary teams
• Detail-oriented and capable of handling multiple assignments at once
• Experience collaborating with Asian manufacturing facilities
• Experience in research laboratories handling analytical or test equipment is an advantage
• Understanding of statistics is an advantage
• Excellent communication and presentation skills.
• Proficiency in MS Office and Windows.

Qualifications: BS in Civil Engineering with 4 years of Experience

• Strong verbal and written communication skills
• Demonstrated strong analytical and problem-solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Experience in optoelectronics manufacturing environments, preferably in high-power semiconductor lasers.
• Strong knowledge and experience of wafer processes and solid background in semiconductor materials/device characterization.
• Good hands-on analytical skills and experience in some/all the following sample preparation and cross-sectioning desired (I.e., SEM, FIB, TEM, X-Ray, CSAM, Raman, FTIR, Auger, AFM, SIMS, XPS, IV).
• Experience with advanced analysis techniques desired (FIB/STEM/TEM/EDS/Raman/CL/TOFF SIMMs/AES etc..).
• Ability to work on multiple tasks in parallel while maintaining clear focus and priority.
• Ability to organize information and clearly communicate.
• Proficiency with MS Office Suite.

Qualifications: BA in Physics with 3 years of Experience