FAILURE ANALYSIS TECHNICIAN SKILLS, EXPERIENCE, AND JOB REQUIREMENTS

Updated: Jun 13, 2025 - The Failure Analysis Technician with a strong technical foundation in mechanics, materials, acoustics, or electronic packaging and proficiency in electrical testing. This position has hands-on experience with electronic component assemblies and familiarity with advanced analysis techniques like SEM, EDX, and FTIR, complemented by adept use of Audio Analyzers and statistical software. This role demands excellent time and project management skills, effective communication abilities, and a solid understanding of PCBAs and electronic schematics.

Essential Hard and Soft Skills for a Standout Failure Analysis Technician Resume
  • Failure Analysis
  • Process Development
  • Report Management
  • FIB Support
  • Lab Maintenance
  • Inspection Techniques
  • Calibration Support
  • FQA Testing
  • SOP Development
  • SEM Operation
  • Cross-functional Collaboration
  • Technical Training
  • Project Coordination
  • Service Center Improvement
  • Quality Improvement
  • Corrective Actions
  • Technical Communication
  • Process Improvement
  • Troubleshooting
  • Training

Summary of Failure Analysis Technician Knowledge and Qualifications on Resume

1. BS in Materials Science and Engineering with 3 years of Experience

  • Experience in R&D quality assurance of complex electromechanical systems
  • Proficient with standard electronics test bench equipment including Function generators, Multimeters, Oscilloscopes
  • Comprehension of electrical schematics to perform circuit troubleshooting
  • Comprehension of mechanical drawings to validate dimensions
  • Experience with robotic systems integration
  • R&D design or test experience in electrical and/or embedded software engineering
  • Arduino, LabJack, and/or Python software test case development
  • Interest in computer vision (OpenCV) or electronics circuit design
  • Experience in other FA techniques including Sample preparation (cross section, delayering, decapsulation) X-Ray and FIB
  • Experience in Wafer Fab/Semiconductor/LED/Solar/HDD industries
  • Good knowledge and understanding of product assembly
  • Good problem-solving skills, failure mode definition and root cause identification.
  • Experience documenting results to drive action in manufacturing facilities.

2. BS in Electrical Engineering with 4 years of Experience

  • Knowledge of analog/digital circuits and semiconductor physics
  • Competence with the operation and application of standard failure analysis tools including X-ray analysis, Acoustic Microscopy, Light Microscopy, Oscilloscopes, signal generator, multimeter, voltage source, and current source.
  • Proficiency utilizing MS Word, Excel, PowerPoint, photo-editing, and writing technical reports
  • Strong hands-on capability, clear logic thinking and good at problem solving. 
  • Good English communication skills in oral English and writing. 
  • Experience working in a manufacturing or warehousing environment
  • Experience with Microsoft Excel
  • Experience using Web-based applications such as a Warehouse Management System, Inventory Management System or similar
  • Experience supporting Windows, Mac and/or Linux Operating systems in a corporate setting
  • Experience using Linux/Unix Operating systems
  • Experience troubleshooting PC and/or Server Hardware

3. BS in Mechanical Engineering with 3 year of Experience

  • Good understanding of FAB process steps including wet etch, dry etch, PVD, ALD, CMP, etc.
  • Ability to prioritize and work independently
  • Strong communication skills (written, verbal and presentation)
  • Ability to analyze problems and provide resolution
  • PC skills to include M.S. Office (PowerPoint, Word, Excel, OneNote)
  • Experience in semiconductor physical failure analysis
  • Understand semiconductor failure analysis methods and techniques.
  • Familiar with analytical methods and tools with hands-on experience in operation of SEM, FIB, AFM, nanoprobing, curve tracing, X-ray tomography, Thermal/Photo Emission fault isolation, CAD layout, sample thinning and de-processing techniques.
  • Skilled in device de-processing, including delayering, cross section and silicon substrate ultra-thinning techniques using milling and wheel machines.
  • Effective interpersonal, strong technical and oral/written communication skills.
  • Ability to write up failure analysis reports
  • Intermediate knowledge of computer hardware systems.

4. BS in Chemical Engineering with 4 years of experience

  • Strong technical background in mechanics, materials, acoustics, or electronic packaging
  • Electrical test experience (basic measurements; Voltage, Current, Resistance and Capacitance)
  • Experience in electronic components or assemblies
  • Familiarity with Audio Analyzers, Minitab, IC micro-probing and analysis techniques such as SEM, EDX, Raman, TOF-SIMS, FTIR, AFM, XPS, Obirch and FIB
  • Excellent oral and written communication skills
  • Software skills include MS Office, Excel, statistical analysis and graphing
  • Communication, interpersonal, and leadership skills
  • SMT Soldering, Time and project management skills
  • Basic electronics knowledge for printed circuit board assemblies (PCBAs) including interaction and function
  • Ability to interpret electronic schematics, including inputs, outputs, and operation
  • Effective teamwork, interpersonal, and communication skills, both written and verbal
  • Basic knowledge of Linux
  • Basic knowledge of networking
  • Ability to work well with others in a team environment, displaying excellent time management skills.
Relevant Information
Failure Analysis Engineer Skills, Experience, and Job Requirements