• Coordinate all internal and external integrated layout design activities.
• Work closely with Manufacturing, Controls Engineering and Project Management.
• Follow a project from its inception to the final customer acceptance and sign-off, and provide follow-up and support after this point.
• Review and release final engineering drawings to the manufacturing department.
• Develop and maintain good relationships with customers and suppliers.
• Organize and participate in system layout review meetings for internal, as well as outsourced, designs.
• Gather required project information from Customers and Suppliers to create specifications.
• Develop layout specifications for the internal mechanical design by outside vendors.
• Ensure the selected suppliers follow Esys processes and meet project quality and delivery expectations, as well as maintain the appropriate budget.

Skills: Layout Coordination, Cross Functional Teamwork, Project Lifecycle Control, Engineering Drawing Release, Customer Supplier Relations, Design Review Management, Specification Development, Supplier Quality Control

• Responsible for documenting information, decisions, and changes related to system layout, etc., from Customers and Suppliers.
• Conduct proper line-ups when handing projects off to Esys Integration for Build.
• Complete project-related purchase requests for system layout work and provide them to purchasing.
• Provide project-specific direction to design suppliers.
• Perform design and build buy-offs and quality checks.
• Review all mechanical engineering drawings prior to final release, ensuring compliance with customer buyoff.
• Ensure that Esys products and services continue to be the benchmark within the industry.
• Demonstrate a commitment to Esys Core Beliefs.

Skills: Technical Documentation, Project Handover, Purchase Request Handling, Supplier Coordination, Design Quality Review, Mechanical Drawing Review, Customer Compliance, Core Values Commitment

• Create PCB layout using Zuken Design Force CR-8000.
• Generate technical documentation for industrial-grade design.
• Coordinate the results with the Hardware Development, Mechanical, Purchasing and Production.
• Perform final layout reviews.
• Communicate with manufacturing.
• Manage product data using Siemens Teamcenter.
• Cooperate with the development team in the Czech Republic and Germany, fluent in English.
• Participate inthe development of solutions for the digitalization of engineering data and engineering documentation.

Skills: PCB Layout Design, Zuken CR-8000, Technical Documentation, Cross Functional Coordination, Final Layout Review, Manufacturing Communication, Teamcenter Data Management, Engineering Digitalization

• Migrate legacy and design new PCBAs to the Mentor Graphics Xpedition Enterprise platform.
• Create the full electronic design package (schematic, layout, TPD) for the board suppliers.
• Ensure data integrity of schematic diagrams and board layout files.
• Cooperate with circuit (functional) designers and mechanical designers regarding electrical design and physical constraints, and organize design review meetings.
• Align with the CAD-E library engineers on the availability of elements.
• Communicate with design engineers and customers.
• Follow development procedures, design guidelines and standards to ensure reliable product quality.
• Implement signal/power-integrity requirements, safety compliance requirements and generic and/or specific industry requirements.

Skills: PCB Platform Migration, Electronic Design Packages, Schematic Data Integrity, Cross Functional Collaboration, CAD Library Alignment, Stakeholder Communication, Design Standards Compliance, Signal Power Integrity

• Perform as Technical Authority for Piping and Layout Discipline Engineering.
• Ensure that costs to the company are minimized and that the project schedule is maintained.
• Manage the Engineering Contractors and Equipment Vendors.
• Follow up and monitor the contractor schedule and progress and ensure any deviation is mitigated by corrective action coordinated with the internal team.
• Responsible for interacting with the client.
• Identify and ensure execution of the piping/layout engineering scope of work in accordance with the legal obligations, contract terms, scope of work, technical requirements and company policy.
• Interact with and support the engineering contractors (including Marine Engineering, Hull Engineering, Topsides Module Engineering, Integration Engineering, Structural Engineering, LQ Engineering, Shipyard Engineering, etc) and equipment/package vendors.
• Achieve resolution of multi-discipline equipment problems by coordinating with other discipline engineers and the project engineering management team.
• Update job knowledge by tracking and understanding emerging methodology improvements and absorbing new practices from clients and partners.
• Solve and troubleshoot engineering problems, even outside one’s own discipline, by taking a holistic approach to the project.
• Coordinate discipline issues between the client, contractors, vendors and other relevant parties.
• Provide input to weekly/monthly progress reporting and other relevant status information.
• Participate in audits and review processes.
• Interact with non-technical disciplines (document control, cost control, planning).

Skills: Piping Technical Authority, Cost Schedule Control, Contractor Vendor Management, Project Progress Monitoring, Client Interaction, Engineering Scope Compliance, Multidiscipline Coordination, Engineering Problem Solving

• Execute floor plan, routing and physical verification of IPs (e.g., analog, mixed-signal and custom digital).
• Create an IP sign-off document and provide support until closure with the Technology team's approval.
• Provide support to full chip activities such as physical integration and physical verification.
• Work effectively with circuit designers to understand key layout constraints.
• Proactively collaborate with the CAD group as issues arise.
• Hold layout quality reviews of completed cells, macros and chip-level.
• Recognize layout considerations pertaining to device matching, noise, shielding, and latch-up in analog, mixed signal and digital circuits.
• Run and analyze LPE, pre/post-layout simulations, IP views such as GBB, power, and timing files.

Skills: IP Physical Layout, Floorplan Routing, Physical Verification, Layout Sign Off, Full Chip Integration, CAD Collaboration, Layout Quality Review, Analog Mixed Signal

• Deliver layout blocks and/or macros according to the top floorplan strategy and circuit specification, as well as on a tight schedule.
• Participate in the IPS/SOC distribution, including power supply strategy, signals and distribution between blocks and toplevel.
• Run all physical verifications as DRC/LVS/DFM and parasitic extractions.
• Achieve high-quality layout deliveries (state-of-the-art integration, all foundry rules and design constraints validated, leading to high-performance blocks).
• Focus on design for quality with the maximum integration possible.
• Leverage layout expertise to write technical guidelines.
• Responsible for block-level and top-level layout of high-speed, precision analog circuits.
• Responsible for floor-plan analog block and/or top-level layouts from design inception to tape out.
• Support team leaders and designers to establish and meet efficient layout schedules and realize compact, high-performance analog layouts.
• Support the continuous improvement of layout methodologies to ensure quality and efficiency.

Skills: Analog Layout Design, Floorplan Strategy, Physical Verification DRC, Parasitic Extraction, High Speed Circuits, Design Quality Focus, Layout Guidelines Authoring, Tape Out Support

• Responsible for custom semiconductor CAD layout and reticle assembly work.
• Conduct reviews at different phases.
• Work with multiple groups to release layouts and order photolithography mask plates.
• Interface with the IT support group for EDA software maintenance and updates.
• Communicate and coordinate both within the working group and with external groups.
• Administrate data as well as creating and maintaining complex circuit diagrams, bills of materials, layouts, and including the necessary documentation.
• Work out specifications (in cooperation with the involved entities) for creating complex circuit diagrams and layouts.
• Create complex and comprehensive circuit diagrams for electronic devices with a multitude of functions.

Skills: Semiconductor Layout, Reticle Assembly, Design Review Coordination, Mask Plate Ordering, EDA Tool Support, Cross Team Communication, Design Data Management, Circuit Diagram Design

• Experience with or knowledge of 3D design tools, or the ability to learn on the job.
• Excellent planning and organizing skills, work well under time constraints and with possible production setbacks.
• Strong communication skills, work with customers and co-workers in a courteous and tactful manner.
• Ability to work independently, as well as being a team member.
• Ability to deliver results and meet customers' expectations.
• Experience and knowledge of process technology.
• Knowledge of the food processing industry requirements.
• Knowledge of relevant production techniques, materials and components.
• Experience with or knowledge of 3D design tools, or the ability to learn on the job.
• Strong English skills, both written and verbal.
• Experience with and comfort working in a multi-cultural, multi-disciplinary organization.

Qualifications: BS in Electrical Engineering with 5 years of Experience

• Must be able to use layout tools such as APD or SiP used for Package layout design.
• Good understanding of package construction and stackup, examples QFN, LGA, FCCSP, FCBGA and other lead-frame, wirebond and organic substrates.
• Good understanding of the material properties used for the buildup, core and laminates.
• Understanding of the assembly process and manufacturing of semiconductor packages.
• Basic knowledge of EM and transmission line theory and how it is applied to package design.
• Basic understanding of S-parameters, Smith Chart and frequency domain analysis.
• Able to be self-motivated, have excellent communication skills, and ability to excel in a fast-paced environment.
• Hands-on experience using EM tools such as HFSS, CST, SiWave, PowerSI, Paksi, ExtractIM, etc.
• Hands-on experience using thermal tools such as Icepak.
• Able to design packages with high-speed interfaces such as PCIe4/5, PAM4(112G), DDR4/5, 5G, and WiFi.
• Hands-on experience with Oscilloscope, Spectrum Analyzer, and VNA.
• Able to use HSPICE, SPECTRE, or ADS and be able to run time and frequency domain simulations.
• Must have packaging experience.

Qualifications: BS in Applied Physics with 7 years of Experience

• Knowledge of device physics and semiconductor components.
• Knowledge of methodology and CAD tools for layout and verification (Cadence, Mentor, Calibre).
• Proficient in interpreting design rule specifications, DRC, LVS and ERC checks on leading foundry flows.
• Experience implementing block-level layout design.
• Strong familiarity with top-level layout, floorplan and die size assessment.
• Knowledge of layout best practices for ESD protection circuits and LU prevention rules.
• Must have a positive attitude, be open-minded, and team-oriented.
• Must have problem-solving skills, being able to find constructive solutions and ideas.
• Good communication skills, understanding the expectations and requirements of a project.
• Good English skills (written and verbal) and the ability to work within global teams.

Qualifications: BS in Electronics Engineering with 5 years of Experience

• Excellent work attitude and tenacity.
• Strong familiarity with CAD tools, Allegro 17.2 and above.
• Able to provide support to PCB engineering and manufacturing units.
• Able to prepare PCB layouts and fabrication and assembly drawings.
• Able to analyze and troubleshoot design and fabrication-related issues in a timely fashion.
• Able to review existing PCB designs and recommend improvements.
• Able to analyze the technical documents (specifications, drawings, etc.) in order to assess the scope of the studies required and the potential risks.
• Able to seek as far-reaching solutions that can bring overall savings to the project.
• Able to check all produced documents (internal or outsourcing) like design reports, technical specifications, drawings, etc, under his responsibility.
• Able to control the input data for the team activities and check/review all the documents issued by the team.
• Able to attend to internal review activities and inter-disciplinary check meetings.
• Able to provide technical support to the Project group.
• Strong communication skills.

Qualifications: BS in Microelectronics Engineering with 8 years of Experience

• Experience in the layout of analog or RF blocks.
• Hands-on expertise in all of the following areas.
• Proficient in floorplanning, power planning, and placement.
• Experience in analog layout techniques, device matching, and differential routing.
• Knowledge in mitigating WPE and LOD effects.
• Competent in extraction, physical verification (DRC and LVS), and EM/IR analysis.
• Experience in full-chip and top-level design with multiple successful tape-outs.
• Proficient in SKILL programming.
• Expertise in the double patterning process of nodes.
• Expertise in Cadence Virtuoso layout suite.
• Good documentation and communication skills.

Qualifications: BS in Semiconductor Engineering with 9 years of Experience

• Good basic knowledge of Layout (Cadence Virtuoso) and Verification (Calibre DRC/LVS) tools.
• Understanding of basic Layout issues (i.e., floor planning, bussing, pin location, etc.) and latch-up/ESD requirements.
• Understanding of hierarchical planning (top-down and bottom-up) and integration.
• Understanding of CMOS matching layout techniques for precision analog circuits.
• Experience with planning power structures and familiar with electro migration and signal integrity issues.
• Understanding of arrayed and pitched layout styles for DACs/ADCs/Decoders/Power Devices.
• Strong debug and problem-solving skills for LVS, DRC and layout issues.
• Advanced proficiency in CAD design work with layout experience with Cadence/Klayout/AWR/similar EDA software.
• Experience with creating/editing DRC rules with tools like Calibre, Assura.

Qualifications: BS in Computer Engineering with 5 years of Experience

• Advanced skills in AutoCAD.
• Advanced skills in Revit.
• Experience using Microsoft Office Suite, Excel, Word and PowerPoint.
• Solid understanding of the layout of analog circuits.
• Experience in lay-outing power circuitry.
• Experience with high voltage design and SOI.
• Experience in working on the floor plan, pin placement, and block top-level assembly.
• Experience with hands-on layout methodology and tools, Cadence, Caliber verification (DRC, LVS, Antenna, etc.)
• Strong interpersonal and communication skills.

Qualifications: BS in Integrated Circuit Design with 9 years of Experience

• Knowledge of layout matching, isolation, and shielding techniques.
• Knowledge of layout-dependent effects.
• Knowledge of different CMOS processes (Planar, FinFeT, and SOIs).
• Knowledge of basic layout verifications (LVS/DRC/ANT).
• Strong familiarity with layout tools (Cadence Virtuoso/Custom Compiler).
• Must have scripting skills (Skill/Tcl/Perl).
• Proficient in industry-standard tools such as Cadence/Synopsys.
• Good communication skills, analytical and problem-solving skills.
• Knowledge of layout techniques and electrical considerations, such as device matching, IR drop, RC effects, shielding, coupling capacitance, etc.
• Working knowledge of deep sub-micron process nodes, 10/7/5/3 nm.

Qualifications: BS in Electronics Engineering with 8 years of Experience